In an effort that will accelerate commercialization of extreme ultraviolet (EUV) lithography technology and the development of next-generation transistors, SEMATECH announced today that Intermolecular, Inc. has joined SEMATECH’s Lithography and Front End Processes (FEP) programs.
The companies have agreed to co-develop new methods to reduce overall cost of ownership (CoO) for Extreme UltraViolet (EUV) lithography, and to co-explore new materials, processes, and integration schemes for advanced logic integrated circuit technologies.
“There are technology gaps the industry needs to address to enable cost-effective insertion of EUV lithography at the 22 nm half-pitch,” said Stefan Wurm, SEMATECH’s director of Lithography. “SEMATECH is pleased to welcome Intermolecular as a partner. We will work together to accelerate the investigation and qualification of chemical formulations needed to establish a production-worthy EUV lithography technology.”
Intermolecular’s High Productivity Combinatorial (HPC) platform provides disruptive research and development (R&D) capability that allows for prototyping and characterization of atomic-scale devices at rates 10-100 times faster than can be achieved with conventional approaches. Such methodologies and technologies will be used in both of the program collaborations.
“As semiconductor dimensions are scaled down further, contact resistance remains a critical issue,” said Tony Chiang, Chief Technology Officer, Intermolecular. “Our unique capabilities to accelerate R&D across leading-edge semiconductor processes and devices complement SEMATECH’s expertise in advanced CMOS test structures and process flows. We are pleased to join in this pre-competitive collaboration intended to accelerate the transfer of new technologies into industry.”
Source: Intermolecular
