A sensor foil made from polymers withstands bending to a radius of 11 mm, and elongation by 1.4% without losing functionality.
Sowing the First Seeds for Edible Electronics
The first seeds towards non-invasive edible electronics are sown.
Geometry- and Topology-Controlled Nanoarchitectures: Focussed Session
An interplay between two realms is the subject of the Focussed Session: Geometry- and Topology-Controlled Nanoarchitectures at the Joint Meeting of DPG (Deutsche Physikalische Gesellschaft) and EPS (European Physical Society) Condensed Matter Divisions on March 13, 2018 at the TU Berlin.
Metamorphic Electronics: Stretching into Complex Forms
Metamorphic and stretchable electronics applications were developed by researchers from the Technical University of Ilmenau, which enable new 3D shapes and new form factors for electronics applications.
Viral-based Nanomaterials for Plasmonic and Photonic Materials and Devices
Researchers are taking advantage of 4 billion years of viral evolution to produce robust protein cages for a wide range of applications in nanotechnology.
Engineering Digest – Featuring Soft Robotics, Mechanical Metamaterials, and More
This month’s Advanced Engineering Materials covers and top papers.
Data-Driven Efficiency Enhancement
Alco Bio Fuel digitally transform their way of operations. Now, software helps to monitor and fine-tune performance of the generator.
A Unique Molding Process for All-Liquid Objects
A team of researchers develop a unique molding process for generating all-liquid structures via interfacial jamming of cellulose nanocrystal (CNC) surfactants. The structures have long-term stability and can adapt or respond to external stimuli, allowing for potential applications in encapsulation, sensors, and liquid electronic devices.
Electrically Driven Bio-Inspired Soft Robots
Researchers design a bio-inspired batoid robot from non-toxic hydrogels operated with Au microelectrodes.
Octopus-Inspired Design of 3D-Printed Hybrid Metamaterials
New designs were fabricated via multimaterial 3D printing and potential applications of sequential particle release mechanisms were systematically explored.